The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Jun. 01, 2015
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Guofang Tang, Guangdong, CN;

Suwen Ye, Guangdong, CN;

Peng Sun, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C08K 3/10 (2018.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); H01L 23/29 (2006.01); B32B 15/08 (2006.01); C08K 5/00 (2006.01); C09J 183/04 (2006.01); C08K 3/01 (2018.01); C08K 5/098 (2006.01); C08K 5/17 (2006.01); C08K 5/5398 (2006.01); C08K 5/5399 (2006.01); C08K 5/5415 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); B32B 15/08 (2013.01); C08K 3/01 (2018.01); C08K 3/10 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 5/00 (2013.01); C09J 183/04 (2013.01); H01L 23/29 (2013.01); C08K 5/098 (2013.01); C08K 5/17 (2013.01); C08K 5/5398 (2013.01); C08K 5/5399 (2013.01); C08K 5/5415 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2237 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/2296 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Provided are an organic silicon resin composition, prepreg and laminate using the same. The organic silicon resin composition glue solution contains a condensation silicon resin, a catalyst, an auxiliary agent, a white filler and a solvent as necessary components, and is impregnated in a reinforced material such as a sheet-like fiberglass fiber base material and then dried to prepare the prepreg. The prepreg has a net structure via crosslinking of the silicon resin using a condensation reaction. Since the organic silicon resin has ultrahigh heat resistance and yellowing resistance, the present invention applies the silicon resin to a white LED copper-clad laminate instead of a traditional organic resin, satisfying the demand for high heat resistance, and replacing the ceramic substrate to be a new heat-dissipating substrate base material.


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