The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Dec. 02, 2014
Applicant:

Shengyi Technology Co., Ltd., Dongguan, Guangdong, CN;

Inventors:

Hui Li, Dongguan, CN;

Kehong Fang, Dongguan, CN;

Assignee:

SHENGYI TECHNOLOGY CO., LTD., Dongguan, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/04 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08G 59/32 (2006.01); C08G 59/38 (2006.01); C08G 59/42 (2006.01); H05K 1/03 (2006.01); B32B 5/02 (2006.01); B32B 27/12 (2006.01); B32B 15/092 (2006.01); C09D 163/00 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 27/04 (2013.01); B32B 27/12 (2013.01); B32B 27/38 (2013.01); C08L 63/00 (2013.01); H05K 1/038 (2013.01); H05K 1/0373 (2013.01); B32B 2255/02 (2013.01); B32B 2255/26 (2013.01); B32B 2262/101 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08J 2435/06 (2013.01); C08J 2471/12 (2013.01); C08J 2479/04 (2013.01); C08L 2201/02 (2013.01); H05K 2201/012 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.


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