The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Mar. 23, 2016
Applicant:
Toray Engineering Co., Ltd., Tokyo, JP;
Inventors:
Takayoshi Fujimoto, Kusatsu, JP;
Masamichi Yamashita, Otsu, JP;
Masaki Mori, Yasu, JP;
Yutaka Oka, Kisarazu, JP;
Assignee:
TORAY ENGINEERING CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/02 (2010.01); H01L 33/52 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 21/00 (2006.01); H01L 21/314 (2006.01); H01L 21/316 (2006.01); H01L 21/56 (2006.01); H01L 33/54 (2010.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 33/44 (2013.01); H01L 33/58 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49107 (2013.01);
Abstract
In an LED module, modes to solve such a problem that a loss in the output of light discharged into the atmosphere occurs are embodied. Specifically, in an LED module in which an LED chip is sealed with a sealing resin, a surface of the sealing resin is covered with a thin film, the thin film is made of a material having a smaller linear expansion coefficient than the sealing resin, and an irregular surface is provided on a surface of the thin film such that light from the LED chip is multiply reflected.