The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Jan. 25, 2018
Applicant:
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H02M 7/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 23/367 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/072 (2013.01); H05K 1/0203 (2013.01); H05K 1/185 (2013.01); H05K 3/30 (2013.01); H05K 3/4644 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/214 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82047 (2013.01); H01L 2924/12031 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H02M 7/06 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10174 (2013.01);
Abstract
A component carrier has an interconnected stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack and a diode, and at least one heat removal layer configured for removing heat from the diode and substantially fully covering a whole main surface of the component carrier.