The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Mar. 27, 2015
Applicants:

Mitsubishi Materials Corporation, Tokyo, JP;

Mitsubishi Materials Electronic Chemicals Co., Ltd., Akita-shi, JP;

Inventors:

Satoko Higano, Naka-gun, JP;

Kazuhiko Yamasaki, Naka-gun, JP;

Kensuke Kageyama, Akita, JP;

Hirokazu Tsukada, Akita, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C09D 11/52 (2014.01); C08L 63/00 (2006.01); H01B 1/22 (2006.01); H05K 1/09 (2006.01); C09D 11/037 (2014.01); C09D 11/102 (2014.01); C08K 9/12 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
H01B 1/02 (2013.01); C08L 63/00 (2013.01); C09D 11/037 (2013.01); C09D 11/102 (2013.01); C09D 11/52 (2013.01); H01B 1/22 (2013.01); H05K 1/095 (2013.01); C08K 9/12 (2013.01); C08K 2003/0806 (2013.01);
Abstract

A conductive paste includes: a silver-coated resin; and an organic vehicle that includes a thermosetting resin composition, a curing agent, and a solvent, in which the thermosetting resin composition is an epoxy resin composition which is solid at room temperature and has a melt viscosity of 0.5 Pa·s or lower at 150° C., and a mass ratio of a content of the thermosetting resin composition to a content of the silver-coated resin is 10 to 40:60 to 90.


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