The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Sep. 25, 2015
Applicants:

Intel Corporation, Santa Clara, CA (US);

Prosenjit Ghosh, Portland, OR (US);

Denica N. Larsen, Portland, OR (US);

James M. Okuley, Portland, OR (US);

Hong W. Wong, Portland, OR (US);

Inventors:

Prosenjit Ghosh, Portland, OR (US);

Denica N. Larsen, Portland, OR (US);

James M. Okuley, Portland, OR (US);

Hong W. Wong, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); G06F 1/16 (2006.01); G06F 13/00 (2006.01); G06F 9/46 (2006.01); E05D 3/06 (2006.01); E05D 11/00 (2006.01); H01R 35/02 (2006.01); E05D 5/10 (2006.01); E05D 11/08 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1683 (2013.01); E05D 3/06 (2013.01); E05D 11/0081 (2013.01); G06F 1/16 (2013.01); G06F 1/1615 (2013.01); G06F 1/1618 (2013.01); G06F 1/1643 (2013.01); G06F 1/1647 (2013.01); G06F 1/1681 (2013.01); G06F 9/46 (2013.01); G06F 13/00 (2013.01); H01R 35/02 (2013.01); E05D 5/10 (2013.01); E05D 11/08 (2013.01); E05D 2005/102 (2013.01); E05Y 2800/102 (2013.01); E05Y 2900/606 (2013.01);
Abstract

Particular embodiments described herein provide for device that includes a first housing that includes a first module, a second housing that includes a second module, and a hinge that rotatable couples the first housing to the second housing. The hinge can include a first axle, a second axle, and a plurality of hinge links. At least one of the hinge links includes an interconnect to provide a communication path between the first module and the second module.


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