The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Nov. 12, 2015
Applicants:

Jenoptik Optical Systems Gmbh, Jena, DE;

Micro-hybrid Electronic Gmbh, Hermsdorf, DE;

Inventors:

Elvira Gittler, Jena, DE;

Steffen Biermann, Hermsdorf, DE;

Wolfgang Brode, Hermsdorf, DE;

Falko Stoerzner, Kraftsdorf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 1/02 (2006.01); G01J 5/04 (2006.01); G01J 5/08 (2006.01); G02B 1/02 (2006.01); G02B 1/10 (2015.01); G02B 7/00 (2006.01); G02B 27/02 (2006.01); H01L 31/0232 (2014.01); C09K 13/00 (2006.01);
U.S. Cl.
CPC ...
G02B 27/022 (2013.01); G01J 1/0271 (2013.01); G01J 5/045 (2013.01); G01J 5/0875 (2013.01); G02B 1/02 (2013.01); G02B 1/10 (2013.01); G02B 7/007 (2013.01); G02B 27/028 (2013.01); H01L 31/02325 (2013.01); C09K 13/00 (2013.01);
Abstract

A method for production of window elements which can be soldered into a housing in a hermetically tight manner with optical coating and free-form window elements are disclosed. After application of optical coatings, a protective layer is applied to the optical coating, the two layer systems are selectively removed by means of a machining beam of high-energy radiation for the purpose of ablation of a desired optically active free-form surface for window elements with any geometric shape through a localized machining beam in edge regions of the optically active free-form surface such that the protective layer remains on the optical coating as lift-off mask which is lifted off after applying a metallization for a solder layer by an etching process that acts selectively only on the protective layer but not on the optical coating, and the metallization remains only on the peripheral edge regions circumscribing the free-form surfaces.


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