The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Dec. 08, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Bing Dang, Chappaqua, NY (US);

Yu Luo, Hopewell Junction, NY (US);

John Knickerbocker, Monroe, NY (US);

Yang Liu, Ossining, NY (US);

Steven L. Wright, Cortlandt Manor, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 31/28 (2006.01); B23K 35/00 (2006.01); H01L 23/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07314 (2013.01); B23K 35/00 (2013.01); B81C 1/00111 (2013.01); G01R 31/2886 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/92 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/06131 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/06136 (2013.01); H01L 2224/111 (2013.01); H01L 2224/11003 (2013.01); H01L 2224/1112 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/131 (2013.01); H01L 2224/136 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/1366 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13657 (2013.01); H01L 2224/13663 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/92 (2013.01); H01L 2224/92222 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/14 (2013.01); H01L 2924/381 (2013.01);
Abstract

A test probe head for probe testing multiple chips on a wafer in a single probing. A probe head substrate includes an array of probe tip attach pads on one surface. The array includes a subarray for each probe head chip test site. Probe tips attached to each probe tip attach pad have an across the head tip height variation less than one micrometer (1 μm). The subarray probe tips may be on a pitch at or less than fifty microns (50 μm). The test probe head may be capable of test probing all chips in a quadrant and even up to all chips on a single wafer in a single probing.


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