The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Jan. 29, 2014
Applicant:
Plansee SE, Reutte, AT;
Inventors:
Christian Linke, Ehenbichl, AT;
Jiehua Li, Leoben, AT;
Peter Schumacher, Leoben, AT;
Wolfram Knabl, Reutte, AT;
Gerhard Leichtfried, Reutte, AT;
Assignee:
Plansee SE, Reutte, AT;
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); B22F 3/02 (2006.01); B22F 3/12 (2006.01); B22F 9/08 (2006.01); B22F 9/04 (2006.01); B22F 1/00 (2006.01); C22C 30/02 (2006.01); C22C 24/00 (2006.01); H01J 37/34 (2006.01); H01L 31/18 (2006.01); C22C 1/04 (2006.01); C22C 9/00 (2006.01); C22C 28/00 (2006.01); B22F 3/15 (2006.01); B22F 3/105 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B22F 1/00 (2013.01); B22F 3/02 (2013.01); B22F 3/12 (2013.01); B22F 9/04 (2013.01); B22F 9/082 (2013.01); C22C 1/0425 (2013.01); C22C 1/0491 (2013.01); C22C 9/00 (2013.01); C22C 24/00 (2013.01); C22C 28/00 (2013.01); C22C 30/02 (2013.01); H01J 37/3426 (2013.01); H01L 31/18 (2013.01); B22F 3/15 (2013.01); B22F 2003/1051 (2013.01); B22F 2998/10 (2013.01);
Abstract
A sputtering target is composed of an alloy consisting of 5 to 70 at % of at least one element from the group of (Ga, In) and 0.1 to 15 at % of Na, the remainder being Cu and typical impurities. The sputtering target includes at least one intermetallic Na-containing phase.