The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Sep. 25, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Telesphor Kamgaing, Chandler, AZ (US);

Adel A. Elsherbini, Chandler, AZ (US);

Emanuel Cohen, Zichron Yaacov, IL;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/16 (2006.01); H04W 76/10 (2018.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01Q 1/22 (2006.01); H04B 1/48 (2006.01); H01L 23/00 (2006.01); H04Q 1/02 (2006.01); H05K 7/14 (2006.01); H01Q 3/30 (2006.01); H04B 1/38 (2015.01);
U.S. Cl.
CPC ...
H04W 76/10 (2018.02); H01L 23/66 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01Q 1/2266 (2013.01); H01Q 1/2283 (2013.01); H04B 1/48 (2013.01); H04Q 1/15 (2013.01); H05K 7/1487 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/16221 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/19105 (2013.01); H01Q 3/30 (2013.01); H04B 1/38 (2013.01);
Abstract

A microelectronic package is described with a wireless interconnect for chip-to-chip communication. In one example, the package includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier, and an antenna on the package substrate coupled to the radio to send the modulated data over the carrier to an external device.


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