The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Jul. 07, 2017
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventor:

Chi Sheng Tseng, Kaohsiung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 27/14618 (2013.01); H01L 27/14627 (2013.01); H01L 27/14643 (2013.01); H01L 27/14685 (2013.01); H01L 27/14689 (2013.01);
Abstract

An image sensor comprises a chip, a first redistribution layer (RDL), a second RDL and a third RDL. The chip has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first RDL is disposed on the first surface of the chip and extends along the first surface of the chip and beyond the lateral surface of the chip. The second RDL is disposed on the second surface of the chip. The third RDL is disposed on the lateral surface of the chip and connects the first RDL to the second RDL.


Find Patent Forward Citations

Tseng, Chi. (2019). Semiconductor package device and method of manufacturing the same (U.S. Patent No. 10325952). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10325952

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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