The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Jan. 09, 2018
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Katsuhiko Suzuki, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 25/00 (2006.01); H01L 21/683 (2006.01); H01L 23/552 (2006.01); H01L 23/538 (2006.01); H01L 21/78 (2006.01); H01L 21/67 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/6836 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 25/50 (2013.01); H01L 21/304 (2013.01); H01L 21/67092 (2013.01); H01L 21/78 (2013.01);
Abstract

A semiconductor device chip includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a semiconductor device disposed on the first surface of the semiconductor substrate, an interconnect pattern having an end connected to the semiconductor device and another end exposed on a surface of a function layer disposed on the first surface of the semiconductor substrate, plurality of external connection electrodes mounted on the surface of the function layer and electrically connected to the other end of the interconnect pattern, an electromagnetic wave shield film for shielding electromagnetic waves, which is disposed on the second surface of the semiconductor substrate and side surfaces of the function layer, and a ground interconnect electrically connected to the electromagnetic shield film and disposed on the function layer.


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