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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10325796 B1

PDFFull Text
Date of Patent:
Jun. 18, 2019

Filed:

Oct. 30, 2017

Apparatus and system for detecting wafer damage

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Yi-Feng Chen, Hsin-Chu, TW;

Yan Cing Lin, Hsinchu, TW;

Chui-Ya Peng, Hsin-Chu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsin-Chu, TW;

Attorney:

Duane Morris LLP

Primary Examiner:

Shahed Ahmed

Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/687 (2006.01); G01B 5/30 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67766 (2013.01); G01B 5/30 (2013.01); H01L 21/67288 (2013.01); H01L 21/68707 (2013.01); H01L 22/12 (2013.01);
Abstract

An apparatus includes a holder configured to carry one or more semiconductor wafers, an arm coupled with the holder, and a detector coupled with either the holder or the arm. The detector is configured to measure a change in weight of the one or more semiconductor wafers. The detector includes a strain gauge weight sensor, a piezoelectric sensor, or any other suitable sensor. The change in weight of the one or more semiconductor wafers is used to determine any possible presence of a broken or missing wafer.

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Chen, Yi-Feng. (2019). Apparatus and system for detecting wafer damage (U.S. Patent No. 10325796). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10325796

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