The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Jul. 15, 2015
Applicant:
Alpha Assembly Solutions Inc., Waterbury, CT (US);
Inventors:
Pritha Choudhury, Waterbury, CT (US);
Morgana De Avila Ribas, Waterbury, CT (US);
Sutapa Mukherjee, Waterbury, CT (US);
Siuli Sarkar, Waterbury, CT (US);
Ranjit Pandher, Waterbury, CT (US);
Ravindra Bhatkal, Waterbury, CT (US);
Bawa Singh, Waterbury, CT (US);
Assignee:
Alpha Assembly Solutions Inc., Somerset, NJ (US);
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 35/26 (2006.01); B23K 35/00 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); B23K 1/00 (2006.01); B23K 1/002 (2006.01); B23K 1/005 (2006.01); B23K 1/08 (2006.01); B23K 35/02 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 1/002 (2013.01); B23K 1/0016 (2013.01); B23K 1/0056 (2013.01); B23K 1/085 (2013.01); B23K 35/00 (2013.01); B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/0227 (2013.01); B23K 35/0233 (2013.01); B23K 35/0238 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01L 2224/2916 (2013.01); H01L 2224/2918 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29117 (2013.01); H01L 2224/29123 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29138 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29149 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29157 (2013.01); H01L 2224/29163 (2013.01); H01L 2224/29166 (2013.01); H01L 2224/29169 (2013.01); H01L 2224/29171 (2013.01); H01L 2224/29172 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01034 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/01058 (2013.01);
Abstract
A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.