The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Jul. 24, 2017
Applicant:
Ibiden Co., Ltd., Ogaki, JP;
Inventor:
Yuji Ikawa, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H05K 3/24 (2006.01); H05K 3/28 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3452 (2013.01); H05K 3/243 (2013.01); H05K 3/28 (2013.01); H05K 3/285 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0577 (2013.01);
Abstract
A solder resist includes a lower layer including a first resin and particles, and an upper layer including a second resin and formed on the lower layer. The particles are one kind selected from a group of inorganic particles, and the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles.
Ikawa, Yuji. (2019). Solder resist and printed wiring board (U.S. Patent No. 10321579). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10321579
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile