The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Dec. 16, 2015
Applicant:

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben-Hinterberg, AT;

Inventors:

Nikolai Haslebner, Graz, AT;

Markus Leitgeb, Trofalach, AT;

Michael Goessler, Kobenz, AT;

Mike Morianz, Graz, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/36 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0266 (2013.01); H05K 1/028 (2013.01); H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H05K 1/115 (2013.01); H05K 1/14 (2013.01); H05K 1/18 (2013.01); H05K 1/182 (2013.01); H05K 1/189 (2013.01); H05K 3/36 (2013.01); H05K 3/4688 (2013.01); H01L 2224/2518 (2013.01); H05K 1/0269 (2013.01); H05K 3/4638 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/058 (2013.01); H05K 2201/09918 (2013.01); H05K 2201/09936 (2013.01); H05K 2203/166 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A circuit board includes a plurality of circuit board areas, wherein the individual circuit board areas include at least one layer made of an in insulating base material and a conducting pattern located on or in, the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.


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