The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Aug. 22, 2016
Applicant:
Nikon Corporation, Tokyo, JP;
Inventors:
Assignee:
NIKON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); C23C 18/54 (2006.01); C23C 18/20 (2006.01); C23C 18/16 (2006.01); C23C 18/28 (2006.01); C23C 18/32 (2006.01); C23C 18/42 (2006.01); C23C 18/30 (2006.01); H01L 51/05 (2006.01); H01L 51/10 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0021 (2013.01); C23C 18/1605 (2013.01); C23C 18/204 (2013.01); C23C 18/2086 (2013.01); C23C 18/285 (2013.01); C23C 18/32 (2013.01); C23C 18/42 (2013.01); C23C 18/54 (2013.01); C23C 18/30 (2013.01); H01L 51/055 (2013.01); H01L 51/0545 (2013.01); H01L 51/105 (2013.01);
Abstract
A wiring pattern production method includes forming, on a substrate, a precursor film for a plating base film including a first formation material having an amino group protected by a photoreactive protecting group, forming a photoresist layer including a photoresist material on a surface of the precursor film, exposing the photoresist layer with a desired pattern of light, exposing the precursor film with a desired pattern of light to form the plating base film, developing the exposed photoresist layer, removing a deprotected protecting group, and depositing an electroless plating catalyst on the exposed surface of the plating base film.