The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Dec. 12, 2014
Applicant:

Hitachi Power Semiconductor Device, Ltd., Hitachi-shi, Ibaraki, JP;

Inventors:

Tetsuya Ishimaru, Tokyo, JP;

Mutsuhiro Mori, Tokyo, JP;

Junichi Sakano, Tokyo, JP;

Kohhei Onda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H02K 19/36 (2006.01); H02K 11/00 (2016.01); H02M 1/08 (2006.01); H02M 7/00 (2006.01); H02M 7/219 (2006.01); H02K 11/04 (2016.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H02M 7/217 (2006.01); H02P 9/00 (2006.01); H01L 23/051 (2006.01); H01L 23/544 (2006.01); H01L 23/367 (2006.01); H02M 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7808 (2013.01); H01L 23/051 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/367 (2013.01); H01L 23/373 (2013.01); H01L 23/544 (2013.01); H01L 24/01 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/66 (2013.01); H01L 24/69 (2013.01); H01L 24/73 (2013.01); H01L 24/75 (2013.01); H01L 24/78 (2013.01); H01L 24/92 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 29/7805 (2013.01); H02K 11/00 (2013.01); H02K 11/046 (2013.01); H02K 19/36 (2013.01); H02M 1/08 (2013.01); H02M 7/003 (2013.01); H02M 7/217 (2013.01); H02M 7/219 (2013.01); H02P 9/00 (2013.01); H01L 23/3107 (2013.01); H01L 23/3135 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/37012 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48499 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/75754 (2013.01); H01L 2224/78753 (2013.01); H01L 2224/78802 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84801 (2013.01); H01L 2224/9221 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H02M 2001/0006 (2013.01);
Abstract

The semiconductor device has a first external electrode having an outer peripheral section, which has a circular shape in top plan view and which is to be attached to an alternator. On the first external electrode there mounted: a MOSFET chip; a control circuitry to which voltages at or a current flowing between a first main terminal and a second main terminal of the MOSFET chip is inputted and which generates, on the basis of the voltages or the current, a control signal applied to a gate of the MOSFET chip; and a capacitor for providing a power supply to the control circuitry. The semiconductor device further has a second external electrode disposed opposite to the first external electrode with respect to the MOSFET chip. An electrical connection is made between the first main terminal of the MOSFET chip and the first external electrode, and between the second main terminal of the MOSFET chip and the second external electrode.


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