The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Jan. 29, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventor:

Vinod R. Purayath, Los Gatos, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 21/311 (2006.01); H01L 21/3065 (2006.01); H01L 21/67 (2006.01); H01L 29/10 (2006.01); H01L 21/308 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/28282 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/67069 (2013.01); H01L 29/1037 (2013.01);
Abstract

Methods of forming-d flash memory cells are described. The methods allow the cells to be produced despite a misalignment in at least two sections (top and bottom), each having multiple charge storage locations. The methods include selectively gas-phase etching dielectric from the bottom memory hole portion by delivering the etchants through the top memory hole. Two options for completing the methods include (1) forming a ledge spacer to allow reactive ion etching of the bottom polysilicon portion without damaging polysilicon or charge-trap/ONO layer on the ledge, and (2) placing sacrificial silicon oxide gapfill in the bottom memory hole, selectively forming protective conformal silicon nitride elsewhere, then removing the sacrificial silicon oxide gapfill before performing the reactive ion etching of the bottom polysilicon portion as before.


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