The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Aug. 31, 2017
Applicant:

Ixys, Llc, Milpitas, CA (US);

Inventor:

Kyoung Wook Seok, Milpitas, CA (US);

Assignee:

IXYS, LLC, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H02M 1/42 (2007.01); H01L 29/08 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/78 (2006.01); H01L 29/861 (2006.01); H01L 29/51 (2006.01); H01L 29/49 (2006.01); H01L 29/45 (2006.01); H01L 29/167 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H02M 1/4225 (2013.01); H01L 29/0623 (2013.01); H01L 29/0692 (2013.01); H01L 29/086 (2013.01); H01L 29/0878 (2013.01); H01L 29/1095 (2013.01); H01L 29/167 (2013.01); H01L 29/456 (2013.01); H01L 29/495 (2013.01); H01L 29/51 (2013.01); H01L 29/7802 (2013.01); H01L 29/8611 (2013.01);
Abstract

A novel four-terminal packaged semiconductor device is particularly useful in a 400 volt DC output PFC boost converter circuit. Within the body of the package an NFET die and a fast inverse diode die are mounted such that a bottomside drain electrode of the NFET is electrically coupled via a die attach tab to a bottomside P type anode region of the inverse diode. First terminal Tis coupled the die attach tab. Second terminal Tis coupled to the gate of the NFET die. Third terminal Tis coupled to the source of the NFET die. Fourth terminal Tis coupled to a topside cathode electrode of the fast inverse diode die. Due to a novel P+ type charge carrier extraction region of the inverse diode die, the packaged device is fast and has a low reverse leakage current in the PFC boost converter circuit application.


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