The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Mar. 02, 2017
Applicant:

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Paul Yu, Sunnyvale, CA (US);

David Meadowcroft, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 9/00 (2006.01); H01R 13/6581 (2011.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4277 (2013.01); G02B 6/4206 (2013.01); G02B 6/428 (2013.01); G02B 6/4244 (2013.01); H01R 13/6581 (2013.01); H05K 7/1427 (2013.01); H05K 9/0037 (2013.01); H05K 9/0058 (2013.01);
Abstract

An SFP transceiver with a die-casting metal housing and a metallic upper cover formed via sheet metal and assembled to the housing to commonly form therebetween a receiving cavity in which a printed circuit board assembly is received. The printed circuit board assembly includes an optical module with a lens structure, around a mating port, including a front face with a pair of tubular structures extending forwardly. A metallic EMI shielding device includes a plate with a pair of sleeves unitarily extending therefrom via a deep drawing method to cover the front face and the tubular structures, respectively. Each sleeve further includes a flange to cover a ring type front end face of the corresponding tubular structure in the front-to-back direction.


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