The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Aug. 25, 2016
Sunedison Semiconductor Limited (Uen201334164h), Singapore, SG;
Peter D. Albrecht, O'Fallon, MO (US);
Carlo Zavattari, Varallo Pombia, IT;
Sumeet S. Bhagavat, St. Charles, MO (US);
Vandan Tanna, O'Fallon, MO (US);
Uwe Hermes, Portland, OR (US);
GlobalWafers Co. Ltd., Hsinchu, TW;
Abstract
Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. The measured amount of displacement of the sidewall is stored as displacement data. Based on the stored data, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.