The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

May. 21, 2018
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventor:

Youri Volokhine, Stevensbeek, NL;

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/689 (2006.01); H03K 17/16 (2006.01); H03K 17/687 (2006.01); H03K 3/00 (2006.01); H01L 29/49 (2006.01); G05F 1/00 (2006.01); H03K 17/691 (2006.01); G01J 5/34 (2006.01); H03F 3/213 (2006.01); H03F 3/193 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H03K 17/689 (2013.01); H01L 23/66 (2013.01); H01L 24/09 (2013.01); H01L 24/49 (2013.01); H03F 3/193 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/09505 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/49096 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/85399 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/207 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/30111 (2013.01); H03F 2200/451 (2013.01); H03F 2200/541 (2013.01);
Abstract

The invention provides a bond wire arrangement comprising a signal bond wire () for operably connecting a first electronic device () to a second electronic device (), and a control bond wire () being arranged alongside the signal bond wire at a distance so as to have a magnetic coupling with the signal bond wire (), and having a first end () coupled to ground, and a second end () coupled to ground via a resistive element (). The proposed solution allows the control of the Q factor (losses) of wire bond inductors during assembly phase, which will save time and reduce overall design cycle as compared to known methods.


Find Patent Forward Citations

Quick Actions:

Volokhine, Youri. (2019). Adjustable losses on bond wire arrangement (U.S. Patent No. 10312905). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10312905

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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