The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Sep. 14, 2017
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Hiromichi Kuriyama, Kuwana, JP;

Masumi Saitoh, Yokkaichi, JP;

Takayuki Ishikawa, Yokkaichi, JP;

Harumi Watanabe, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); G11C 13/00 (2006.01); G11C 11/56 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 45/145 (2013.01); G11C 11/5614 (2013.01); G11C 13/0011 (2013.01); G11C 13/0069 (2013.01); H01L 27/2463 (2013.01); H01L 45/085 (2013.01); H01L 45/1233 (2013.01); H01L 45/141 (2013.01); H01L 45/146 (2013.01); H01L 45/1616 (2013.01); G11C 2213/15 (2013.01); G11C 2213/54 (2013.01);
Abstract

According to one embodiment, a variable resistance element includes first and conductive layers and first and second layers. The first conductive layer includes a first element including at least one selected from the group consisting of silver, copper, aluminum, nickel, and titanium. The second conductive layer includes at least one selected from the group consisting of platinum, gold, iridium, tungsten, palladium, rhodium, titanium nitride, and silicon. A first layer contacts the first conductive layer, and is provided between the first and second conductive layers. The first layer includes a first material. The first material is insulative. The second layer includes a second element and a second material and is provided between the first layer and the second conductive layer. The second element includes at least one selected from the group consisting of silver, copper, aluminum, nickel, and titanium. The second material is different from the first material.


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