The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Oct. 02, 2015
Applicant:

University of Florida Research Foundation, Incorporated, Gainesville, FL (US);

Inventors:

Fan Ren, Gainesville, FL (US);

Stephen John Pearton, Gainesville, FL (US);

Mark E. Law, Gainesville, FL (US);

Ya-Hsi Hwang, Gainesville, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/205 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/20 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 29/778 (2013.01); H01L 29/0657 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/4175 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 23/36 (2013.01); H01L 29/41758 (2013.01); H01L 2924/0002 (2013.01);
Abstract

III-nitride based high electron mobility transistors (HEMTs), such as AlGaN/GaN HEMTs on Silicon substrates, with improved heat dissipation are described herein. A semiconductor device having improved heat dissipation may include a substrate having a top surface and a bottom surface, a nucleation layer on the top surface of the substrate, a transition layer on the nucleation layer, a buffer layer on the transition layer, a barrier layer on the buffer layer, and a metal layer filling a via hole that extends from the bottom surface of the substrate to a bottom surface of the transition layer.


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