The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Sep. 02, 2013
Applicant:

Semiconductor Technologies & Instruments Pte Ltd, Singapore, SG;

Inventors:

Jian Ping Jin, Singapore, SG;

Leng Kheam Lee, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B25B 27/14 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); B25J 11/00 (2006.01); B25J 15/06 (2006.01); H01L 21/677 (2006.01); G01B 11/27 (2006.01); G01N 21/95 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); B25J 11/0095 (2013.01); B25J 15/0616 (2013.01); B25J 15/0658 (2013.01); B25J 15/0666 (2013.01); G01B 11/27 (2013.01); G01N 21/9501 (2013.01); H01L 21/67144 (2013.01); H01L 21/67706 (2013.01); H01L 21/6838 (2013.01); H01L 21/68757 (2013.01); G01N 2201/025 (2013.01); Y10T 29/49826 (2015.01);
Abstract

A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.


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