The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Mar. 01, 2016
Kabushiki Kaisha Toyota Chuo Kenkyusho, Nagakute-shi, Aichi-ken, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Yasuki Hirota, Nagakute, JP;
Takafumi Yamauchi, Nagakute, JP;
Ryuichi Iwata, Nagakute, JP;
Takashi Shimazu, Nagakute, JP;
Masaki Morita, Toyota, JP;
Manabu Orihashi, Okazaka, JP;
KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO, Nagakute-shi, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
Abstract
An adsorption heat pump includes: an evaporator/condenser including a section that evaporates a first heat exchange-medium and pipe through which a second heat exchange-medium flows; first adsorption devices, each including an adsorption-section in which the first heat exchange-medium that has been evaporated reacts and retains the first heat exchange-medium, and pipe through which the second heat exchange-medium flows; and second adsorption device in which first heat exchange-medium that has been released from the first adsorption devices reacts and retains the first heat exchange-medium. The adsorption-section of the first adsorption device in a state reacting with the first heat exchange-medium is in communication with the evaporator/condenser section, and the adsorption-section of the first adsorption device is in a state having adsorbed the first heat exchange-medium is in communication with the second adsorption device adsorption-section, and the first adsorption device pipe is connected to the evaporator/condenser pipe in series, thereby generating cooling.