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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10308808 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Jun. 01, 2015

Organic silicone resin composition and pre-preg, laminate, copper-clad laminate, and aluminum substrate that use the composition

Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Suwen Ye, Guangdong, CN;

Guofang Tang, Guangdong, CN;

Assignee:

SHENGYI TECHNOLOGY CO., LTD., , CN;

Attorney:

McDonald Hopkins LLC

Primary Examiner:

Robert S Loewe

Int. Cl.
CPC ...
C08L 83/06 (2006.01); B32B 27/04 (2006.01); C08K 3/36 (2006.01); C08K 5/098 (2006.01); C08L 83/04 (2006.01); C08K 3/013 (2018.01); B32B 38/08 (2006.01); C08G 77/08 (2006.01); C08G 77/00 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); C09D 183/06 (2006.01); C08G 77/16 (2006.01); C08G 77/18 (2006.01);
U.S. Cl.
CPC ...
C08L 83/06 (2013.01); B32B 27/04 (2013.01); B32B 38/08 (2013.01); C08G 77/08 (2013.01); C08G 77/16 (2013.01); C08G 77/18 (2013.01); C08G 77/80 (2013.01); C08J 5/24 (2013.01); C08K 3/013 (2018.01); C08K 3/36 (2013.01); C08K 5/098 (2013.01); C08L 83/04 (2013.01); C09D 183/06 (2013.01); H05K 1/036 (2013.01); H05K 1/0373 (2013.01); B32B 2307/304 (2013.01); B32B 2307/3065 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/0358 (2013.01); H05K 2201/068 (2013.01);
Abstract

The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufacturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.

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