logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10308787 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Mar. 22, 2017

Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Kazunori Kondo, Takasaki, JP;

Yoichiro Ichioka, Annaka, JP;

Michihiro Sugo, Takasaki, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Margaret G Moore

Int. Cl.
CPC ...
C08G 77/14 (2006.01); C08K 3/36 (2006.01); C08J 5/18 (2006.01); C09J 183/04 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); C08G 59/32 (2006.01); C08G 59/42 (2006.01); C08G 59/50 (2006.01); C08G 59/62 (2006.01); C09D 183/10 (2006.01); C09D 183/14 (2006.01); C08L 83/10 (2006.01); C08L 83/14 (2006.01); H01L 23/29 (2006.01); C08G 77/52 (2006.01); C08G 77/455 (2006.01);
U.S. Cl.
CPC ...
C08K 3/36 (2013.01); C08G 59/3281 (2013.01); C08G 59/4215 (2013.01); C08G 59/5073 (2013.01); C08G 59/621 (2013.01); C08J 5/18 (2013.01); C08L 83/10 (2013.01); C08L 83/14 (2013.01); C09D 183/10 (2013.01); C09D 183/14 (2013.01); C09J 183/04 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/296 (2013.01); C08G 77/14 (2013.01); C08G 77/455 (2013.01); C08G 77/52 (2013.01); C08J 2383/04 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract

The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000, (B) an epoxy resin-curing agent; and (C) a filler. This can provide a resin composition and a resin film that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection performance, good adhesion properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably. The present invention also provides a method for producing the resin film, a semiconductor device molded with the resin film, and a method for producing the semiconductor device.

Find Patent Forward Citations

Loading…