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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10307995 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Jul. 16, 2013

Polypropylene impact copolymer based hot melt adhesive

Applicant:

Bostik, Inc., Wauwatosa, WI (US);

Inventors:

Patrick John Czaplewski, New Berlin, WI (US);

Steven Daniel Gray, Mequon, WI (US);

Assignee:

Bostik, Inc., Wauwatosa, WI (US);

Attorney:

Christopher Lewis

Primary Examiner:

Shawn Mckinnon

Assistant Examiner:

Lashawnda T McKinnon

Int. Cl.
CPC ...
C09J 123/14 (2006.01); B32B 5/02 (2006.01); B32B 27/08 (2006.01); B32B 7/12 (2006.01); B32B 25/08 (2006.01); C09J 123/12 (2006.01); B32B 5/26 (2006.01); B32B 25/10 (2006.01); B32B 27/12 (2006.01); B32B 27/32 (2006.01); C09J 123/16 (2006.01); C08K 5/00 (2006.01); C08L 23/12 (2006.01); C08L 23/16 (2006.01);
U.S. Cl.
CPC ...
B32B 25/08 (2013.01); B32B 5/02 (2013.01); B32B 5/022 (2013.01); B32B 5/26 (2013.01); B32B 7/12 (2013.01); B32B 25/10 (2013.01); B32B 27/12 (2013.01); B32B 27/32 (2013.01); C08K 5/0016 (2013.01); C08L 23/12 (2013.01); C08L 23/16 (2013.01); C09J 123/12 (2013.01); C09J 123/16 (2013.01); B32B 2307/51 (2013.01); B32B 2439/00 (2013.01); B32B 2519/00 (2013.01); B32B 2554/00 (2013.01); B32B 2555/00 (2013.01); B32B 2555/02 (2013.01); C08L 2205/03 (2013.01); C08L 2207/02 (2013.01); Y10T 442/601 (2015.04); Y10T 442/659 (2015.04);
Abstract

A hot melt adhesive using polypropylene impact copolymers that is particularly well suited for elastic attachment and stretch films in diaper structures. The hot melt adhesive composition is a blend of about 2.5% to about 30%, by weight, of a polypropylene impact copolymer; about 2.5% to about 30%, by weight, of an olefin based elastomer; about 10% to about 70%, by weight, of a tackifying resin having a softening point of at least about 80° C. and up to about 140° C.; about 0% to about 60%, by weight, of a plasticizer; and about 0.1% to about 5% of a stabilizer or antioxidant.

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