The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Nov. 05, 2014
Applicants:

Franz Hollinger, Oberreidenbach, DE;

Karel Maykel Richard Van Der Stam, Apeldoorn, NL;

Dick Verhaart, Eindhoven, NL;

Guido Martinus Henricus Knippels, Schijndel, NL;

Inventors:

Franz Hollinger, Oberreidenbach, DE;

Karel Maykel Richard Van Der Stam, Apeldoorn, NL;

Dick Verhaart, Eindhoven, NL;

Guido Martinus Henricus Knippels, Schijndel, NL;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/06 (2014.01); B23K 26/067 (2006.01); B23K 26/364 (2014.01); H01L 21/67 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/364 (2015.10); B23K 26/0676 (2013.01); B23K 2103/56 (2018.08); H01L 21/67092 (2013.01);
Abstract

An apparatus for cutting a substrate comprises first and second lasers, and first and second optical fibers each having an input end and an output end opposite to the input end, wherein the input ends of the first and second optical fibers are connected to the first and second lasers respectively. The output ends of the first and second optical fibers are movable relative to the substrate and are configured to image first and second laser beams onto the substrate simultaneously for cutting the substrate.


Find Patent Forward Citations

Loading…