The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Jan. 12, 2018
Laird Technologies, Inc., Earth City, MO (US);
Karen J. Bruzda, Cleveland, OH (US);
Troy Dewayne Derksen, Big Lake, MN (US);
David B. Wood, St. Louis, MO (US);
Laird Technologies, Inc., Earth City, MO (US);
Abstract
Disclosed are exemplary embodiments of thermal management and/or EMI (electromagnetic interference) mitigation materials with modified or custom colored exterior surfaces. The thermal management and/or EMI mitigation materials disclosed herein may comprise thermal interface materials (e.g., thermally-conductive pads or gap fillers, thermally-conductive dielectric materials, etc.), EMI shielding materials (e.g., EMI suppression materials, electrically-conductive thermal insulators, EMI absorbers etc.), microwave absorbers (e.g., microwave absorbing elastomers, microwave absorbing foams, EMI/RF/microwave absorbers, etc.), combinations thereof, etc. The thermal management and/or EMI mitigation materials disclosed herein may comprise combined thermal management and EMI mitigation materials, such as hybrid thermal/EMI absorbers, thermally-conductive microwave absorbers, hybrid absorber/thermal management materials usable for EMI mitigation, combined thermal interface and EMI shielding materials (e.g., thermally-conductive and electrically-conductive materials, thermally-conductive and EMI shielding/absorbing materials, etc.), etc.