The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Dec. 18, 2017
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Inventors:
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 23/12 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H05K 1/115 (2013.01); H05K 3/0035 (2013.01); H05K 3/40 (2013.01); H05K 3/429 (2013.01); H05K 3/46 (2013.01); H05K 3/4602 (2013.01); H01L 23/49811 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09827 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1194 (2013.01);
Abstract
A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.