The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Dec. 10, 2015
Applicant:

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Hannes Stahr, St. Lorenzen im Mürztal, AT;

Andreas Zluc, Leoben, AT;

Timo Schwarz, St. Michael i.O., AT;

Gerald Weidinger, Leoben, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/538 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 21/481 (2013.01); H01L 21/4857 (2013.01); H01L 23/145 (2013.01); H01L 23/5383 (2013.01); H01L 23/5387 (2013.01); H01L 23/5389 (2013.01); H01L 23/562 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 1/0393 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 1/189 (2013.01); H05K 3/0017 (2013.01); H05K 3/0097 (2013.01); H05K 3/4602 (2013.01); H01L 21/568 (2013.01); H01L 23/5385 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3511 (2013.01); H05K 1/0353 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09136 (2013.01);
Abstract

A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.


Find Patent Forward Citations

Loading…