The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Dec. 26, 2013
David Pidwerbecki, Hillsboro, OR (US);
Mark Gallina, Hillsboro, OR (US);
Mark Hemmeyer, Hillsboro, OR (US);
Steven Lofland, Portland, OR (US);
Ponniah Ilavarasan, Portland, OR (US);
Michael Stewart, Hillsboro, OR (US);
Kevin Byrd, Lake Oswego, OR (US);
David Pidwerbecki, Hillsboro, OR (US);
Mark Gallina, Hillsboro, OR (US);
Mark Hemmeyer, Hillsboro, OR (US);
Steven Lofland, Portland, OR (US);
Ponniah Ilavarasan, Portland, OR (US);
Michael Stewart, Hillsboro, OR (US);
Kevin Byrd, Lake Oswego, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.