The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Nov. 18, 2015
Applicant:

Agc Inc., Tokyo, JP;

Inventors:

Tomoya Hosoda, Tokyo, JP;

Yasuhiko Matsuoka, Tokyo, JP;

Toru Sasaki, Tokyo, JP;

Wataru Kasai, Tokyo, JP;

Assignee:

AGC Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 3/30 (2006.01); B32B 27/08 (2006.01); H01B 3/44 (2006.01); C08F 214/26 (2006.01); C08J 5/12 (2006.01); B32B 27/28 (2006.01); B29C 65/02 (2006.01); B29C 65/00 (2006.01); H01B 13/08 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B29K 627/18 (2006.01); B29K 679/00 (2006.01); B29L 9/00 (2006.01); B29L 31/34 (2006.01); B29C 63/00 (2006.01); B29C 63/02 (2006.01);
U.S. Cl.
CPC ...
H01B 3/306 (2013.01); B29C 65/022 (2013.01); B29C 66/5326 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/304 (2013.01); B32B 27/322 (2013.01); C08F 214/262 (2013.01); C08J 5/121 (2013.01); H01B 3/445 (2013.01); H01B 13/0891 (2013.01); B29C 63/0065 (2013.01); B29C 63/02 (2013.01); B29K 2627/18 (2013.01); B29K 2679/08 (2013.01); B29L 2009/00 (2013.01); B29L 2031/3412 (2013.01); B29L 2031/3462 (2013.01); B32B 2250/24 (2013.01); B32B 2307/206 (2013.01); B32B 2307/306 (2013.01); B32B 2307/50 (2013.01); B32B 2307/54 (2013.01); B32B 2307/712 (2013.01); B32B 2307/714 (2013.01); B32B 2457/00 (2013.01); B32B 2457/04 (2013.01); B32B 2605/18 (2013.01); C08J 2327/12 (2013.01); C08J 2379/08 (2013.01);
Abstract

To provide an insulating tape for covering, in which a polyimide film and a fluorinated resin film are laminated with excellent adhesion, and a method for producing a structure, which comprises covering a conductor with such an insulating tape for covering, followed by thermal treatment. The insulating tape for covering, comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.


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