The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Aug. 20, 2015
Applicant:

Csmc Technologies Fab1 Co., Ltd., Jiangsu, CN;

Inventor:

Errong Jing, Jiangsu, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); B81C 1/00 (2006.01); G01J 1/04 (2006.01); G01J 1/42 (2006.01); G01J 5/02 (2006.01);
U.S. Cl.
CPC ...
B81B 7/02 (2013.01); B81C 1/00 (2013.01); B81C 1/0015 (2013.01); G01J 1/04 (2013.01); G01J 1/42 (2013.01); G01J 5/024 (2013.01); B81B 2201/0278 (2013.01); B81B 2203/0118 (2013.01); B81C 2201/0197 (2013.01);
Abstract

A method for manufacturing a MEMS double-layer suspension microstructure comprises steps of: forming a first film body on a substrate, and a cantilever beam connected to the substrate and the first film body; forming a sacrificial layer on the first film body and the cantilever beam; patterning the sacrificial layer located on the first film body to manufacture a recessed portion used for forming a support structure, the bottom of the recessed portion being exposed of the first film body; depositing a dielectric layer on the sacrificial layer; patterning the dielectric layer to manufacture a second film body and the support structure, the support structure being connected to the first film body and the second film body; and removing the sacrificial layer to obtain the MEMS double-layer suspension microstructure.


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