The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Oct. 02, 2017
Applicant:

Plume Design, Inc., Palo Alto, CA (US);

Inventors:

Richard Tzewei Chang, Sunnyvale, CA (US);

Yoseph Malkin, San Jose, CA (US);

Patrick Hanley, San Mateo, CA (US);

Jeffrey ChiFai Liew, Millbrae, CA (US);

Liem Hieu Dinh Vo, San Jose, CA (US);

Duc Minh Nguyen, San Jose, CA (US);

Nora Yan, San Mateo, CA (US);

Hiroshi Mendoza, Copenhagen, DK;

William McFarland, Portola Valley, CA (US);

Assignee:

Plume Design, Inc., Palo Alto, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20209 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01);
Abstract

An electronic device includes a first circuit board and a second circuit board each stacked relative to one another; and a mid-spreader disposed between the first circuit board and the second circuit board, wherein the mid-spreader includes a heat conductive material in thermal contact with one or more components on each of the first circuit board and the second circuit board to act as a heat sink, and wherein the mid-spreader is thermally connected to one or more heat sinks, the mid-spreader is one of disposed to or integrally formed with the one or more heat sinks, and the mid-spreader extends beyond a size of at least one of the first circuit board and the second circuit board to conduct and transfer heat therefrom.


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