The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Aug. 28, 2012
Applicant:
Soon Yong Park, Daejeon, KR;
Inventor:
Soon Yong Park, Daejeon, KR;
Assignee:
SHENGYI TECHNOLOGY CO., LTD., Dongguan, Guangdong, CN;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/00 (2006.01); C08G 73/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0346 (2013.01); C08G 73/10 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0154 (2013.01); Y10T 428/24999 (2015.04); Y10T 428/249977 (2015.04); Y10T 428/31681 (2015.04);
Abstract
The present invention is related to a polymer resin composition capable of providing an insulating material having a low dielectric constant and excellent mechanical properties, a polyimide resin film obtained by using the polymer resin composition, a preparation method of a polyimide resin film, and a circuit board and a metal laminate including the polyimide resin film.
Park, Soon. (2019). Polymer resin composition, polyimide resin film, preparation method of polyimide resin film, flexible metal laminate, and circuit board (U.S. Patent No. 10299378). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10299378
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile