The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

May. 17, 2016
Applicant:

Nikon Corporation, Tokyo, JP;

Inventors:

Shohei Koizumi, Atsugi, JP;

Takashi Sugizaki, Yokohama, JP;

Yusuke Kawakami, Yokohama, JP;

Assignee:

NIKON CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/288 (2006.01); H01L 21/28 (2006.01); H01L 29/786 (2006.01); H01L 51/00 (2006.01); H01L 51/05 (2006.01); C23C 18/31 (2006.01); C23C 18/32 (2006.01); C23C 28/00 (2006.01); C23C 18/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); C23C 18/30 (2006.01); C23C 18/34 (2006.01); C23C 18/42 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0541 (2013.01); C23C 18/1605 (2013.01); C23C 18/31 (2013.01); C23C 18/32 (2013.01); C23C 28/00 (2013.01); G03F 7/20 (2013.01); G03F 7/32 (2013.01); G03F 7/40 (2013.01); H01L 29/786 (2013.01); H01L 51/0023 (2013.01); H01L 51/0545 (2013.01); C23C 18/1651 (2013.01); C23C 18/30 (2013.01); C23C 18/34 (2013.01); C23C 18/42 (2013.01); H01L 51/0005 (2013.01);
Abstract

A wiring pattern manufacturing method includes: applying a liquid body including a first formation material on a substrate to form a base film; applying a liquid body including a second formation material on at least part of a surface of the base film to form a protection layer of the base film; forming a resist layer on a surface of the protection layer to expose the resist layer with desired patterning light; causing the exposed resist layer to come into contact with a developer to remove the resist layer and the protection layer until the base film is uncovered corresponding to the patterning light; and after depositing a catalyst on a surface of the uncovered base film, causing an electroless plating solution to come into contact with the surface of the base film to perform electroless plating.


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