The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Nov. 23, 2016
Applicant:
Rohinni, Llc, Coeur d' Alene, ID (US);
Inventors:
Cody Peterson, Hayden, ID (US);
Andrew Huska, Liberty Lake, WA (US);
Justin Wendt, Post Falls, ID (US);
Assignee:
Rohinni, LLC, Coeur d'Alene, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); B32B 37/00 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 33/54 (2010.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); B32B 37/025 (2013.01); G02F 1/133603 (2013.01); H01L 21/67144 (2013.01); H01L 21/68 (2013.01); H01L 21/6836 (2013.01); H01L 24/00 (2013.01); H01L 33/00 (2013.01); H01L 33/54 (2013.01); B32B 2457/14 (2013.01); G02F 1/133605 (2013.01); G02F 1/133606 (2013.01); G02F 2001/133612 (2013.01); H01L 2933/005 (2013.01);
Abstract
An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The semiconductor die is disposed on the transfer surface of the product substrate such that at least a portion of the first surface is in contact with the transfer surface, and at least a portion of the second surface is embedded onto the product substrate, beneath a plane that extends across the transfer surface.