The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Sep. 30, 2016
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Bhadri N. Varadarajan, Beaverton, OR (US);

Bo Gong, Sherwood, OR (US);

Guangbi Yuan, Beaverton, OR (US);

Zhe Gui, Beaverton, OR (US);

Fengyuan Lai, Tualatin, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/50 (2006.01); C23C 16/455 (2006.01); C23C 16/40 (2006.01); C23C 16/32 (2006.01); C23C 14/48 (2006.01); H01J 37/32 (2006.01); H01L 29/49 (2006.01); H01L 21/768 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02216 (2013.01); C23C 14/48 (2013.01); C23C 16/325 (2013.01); C23C 16/401 (2013.01); C23C 16/45523 (2013.01); C23C 16/45525 (2013.01); C23C 16/50 (2013.01); H01J 37/32009 (2013.01); H01J 37/3244 (2013.01); H01L 21/02126 (2013.01); H01L 21/02274 (2013.01); H01L 21/768 (2013.01); H01L 29/4983 (2013.01); H01L 29/78 (2013.01); H01J 2237/334 (2013.01);
Abstract

Provided are methods and apparatuses for depositing a graded or multi-layered silicon carbide film using remote plasma. A graded or multi-layered silicon carbide film can be formed under process conditions that provide one or more organosilicon precursors onto a substrate in a reaction chamber. Radicals of source gas in a substantially low energy state, such as radicals of hydrogen in the ground state, are provided from a remote plasma source into reaction chamber. In addition, co-reactant gas is flowed towards the reaction chamber. In some implementations, radicals of the co-reactant gas are provided from the remote plasma source into the reaction chamber. A flow rate of the co-reactant gas can be changed over time, incrementally or gradually, to form a multi-layered silicon carbide film or a graded silicon carbide film having a composition gradient from a first surface to a second surface of the graded silicon carbide film.


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