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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10294324 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Mar. 28, 2016

Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device

Applicant:

Namics Corporation, Niigata, JP;

Inventors:

Takashi Yamaguchi, Niigata, JP;

Shinichi Abe, Niigata, JP;

Assignee:

NAMICS CORPORATION, Niigata, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Khanh T Nguyen

Int. Cl.
CPC ...
C09J 9/02 (2006.01); C08G 59/56 (2006.01); C08G 59/60 (2006.01); C08G 73/12 (2006.01); C09J 11/06 (2006.01); C09J 161/34 (2006.01); C09J 163/00 (2006.01); C09J 179/04 (2006.01); C08L 61/34 (2006.01); C08L 63/00 (2006.01); H01L 21/288 (2006.01); C09J 11/04 (2006.01); C08L 79/02 (2006.01);
U.S. Cl.
CPC ...
C08G 59/60 (2013.01); C08G 59/56 (2013.01); C08G 73/12 (2013.01); C08L 61/34 (2013.01); C08L 63/00 (2013.01); C08L 79/02 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 161/34 (2013.01); C09J 163/00 (2013.01); C09J 179/04 (2013.01); H01L 21/288 (2013.01);
Abstract

There is provided a resin composition which has long-term heat resistance, rapid curing properties, high adhesive strength during heating, a low change ratio of adhesive strength, and a low normal temperature elastic modulus. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide and/or imidazoles, (C) bismaleimides, and (D) a compound having in its molecule one or more epoxy groups, or cyanate ester.

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Yamaguchi, Takashi. (2019). Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device (U.S. Patent No. 10294324). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10294324

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