The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Dec. 16, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Peter John McElheny, Morgan Hill, CA (US);

Aravind Dasu, Milpitas, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/02 (2006.01); H04L 9/06 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H03K 19/177 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H04L 9/065 (2013.01); H01L 23/3675 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H03K 19/177 (2013.01); H03K 19/1776 (2013.01); H01L 23/36 (2013.01); H01L 24/17 (2013.01); H01L 25/0652 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1443 (2013.01);
Abstract

A system may include a host processor, an interposer having memory elements, a coprocessor mounted on the interposer for accelerating tasks received from the host processor, and an auxiliary chip. The coprocessor, interposer, and auxiliary chip may be part of an integrated circuit package. The memory elements on the interposer may convey configuration bit streams to one or more logic sectors in programmable circuitry of the coprocessor. The interposer may be connected to a package substrate of the integrated circuit package using through-silicon vias, such that an active surface of the interposer faces an active surface of the coprocessor. Each logic sector may include one or more data registers that are loaded with configuration data from the memory elements. In some instances, the auxiliary chip may include a secondary memory for storing additional configuration bit streams for configuring the logic sectors of the coprocessor.


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