The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Sep. 21, 2017
Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventors:

Chao Feng Yeh, Yokkaichi, JP;

Jongsun Sel, Los Gatos, CA (US);

Zhen Chen, Yokkaichi, JP;

Assignee:

SANDISK TECHNOLOGIES LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/792 (2006.01); H01L 27/24 (2006.01); H01L 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/2454 (2013.01); H01L 27/2463 (2013.01); H01L 45/1206 (2013.01); H01L 45/1233 (2013.01); H01L 45/16 (2013.01);
Abstract

Doped semiconductor strips, a planar insulating spacer layer, a gate conductor material layer, and a dielectric cap layer are formed over a substrate. A two-dimensional array of openings is formed through the dielectric cap layer and the gate electrode material layer. Gate dielectrics are formed in the two-dimensional array of openings, and vertical semiconductor channels are formed on each of the gate dielectrics. Gate divider rail structures are formed through the gate conductor material layer. The gate divider rail structures divide the gate conductor material layer into a one-dimensional array of gate electrode lines. Each of the gate electrode lines includes a one-dimensional array of openings arranged along a horizontal direction to form a two-dimensional array of hole-type surrounding gate vertical field effect transistors.


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