The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Apr. 06, 2016
Applicant:

Namics Corporation, Niigata-shi, Niigata, JP;

Inventors:

Raymond Dietz, Byfield, MA (US);

Cathy Shaw Trumble, Barrington, NH (US);

Maciej Patelka, San Jose, CA (US);

Akito Yoshii, Niigata, JP;

Noriyuki Sakai, Niigata, JP;

Hiroshi Yamaguchi, Niigata, JP;

Assignee:

NAMICS CORPORATION, Niigata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 23/40 (2006.01); H01L 21/52 (2006.01); C03C 4/14 (2006.01); C03C 8/02 (2006.01); C03C 8/08 (2006.01); C03C 8/24 (2006.01); C03C 10/00 (2006.01); C03C 3/12 (2006.01); C03C 3/14 (2006.01); C03C 3/21 (2006.01); C03C 8/18 (2006.01); C03C 27/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C03C 3/122 (2013.01); C03C 3/14 (2013.01); C03C 3/21 (2013.01); C03C 4/14 (2013.01); C03C 8/02 (2013.01); C03C 8/08 (2013.01); C03C 8/18 (2013.01); C03C 8/24 (2013.01); C03C 10/00 (2013.01); C03C 27/044 (2013.01); H01L 21/52 (2013.01); H01L 23/40 (2013.01); H01L 24/83 (2013.01); C03C 2204/00 (2013.01); C03C 2205/00 (2013.01); H01L 2224/29188 (2013.01); H01L 2224/8389 (2013.01); H01L 2924/0535 (2013.01); H01L 2924/0541 (2013.01); H01L 2924/05994 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01);
Abstract

A method of manufacturing a bonded body in which a first body and a second body are bonded using a glass paste. The glass paste includes a crystallized glass frit (A) and a solvent (B). A remelting temperature of the crystallized glass frit (A) is higher than a crystallization temperature thereof which is higher than a glass transition temperature thereof. The method includes: applying the glass paste on at least one of the first and second bodies, bonding the first and second bodies by interposing the glass paste therebetween, heating the bonded first and second bodies to a temperature that is not lower than the crystallization temperature and lower than the remelting temperature of the crystallized glass frit (A), and obtaining the bonded body by cooling the bonded first and second bodies to a temperature that is not higher than the glass transition temperature of the crystallized glass frit.


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