The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Jun. 15, 2018
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Teruhiro Kuwajima, Ibaraki, JP;

Akira Matsumoto, Ibaraki, JP;

Yasutaka Nakashiba, Ibaraki, JP;

Takashi Iwadare, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 23/4952 (2013.01); H01L 23/49551 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/49175 (2013.01);
Abstract

A SOP has a semiconductor chip. The chip includes a pair of a lower layer coil and an upper layer coil laminated through an interlayer insulating film formed therebetween, a first circuit unit electrically coupled to the upper layer coil, and a plurality of electrode pads. Further, it has a wire for electrically coupling the upper layer coil and the first circuit unit, a plurality of inner leads and outer leads arranged around the semiconductor chip, a plurality of wires for electrically coupling the electrode pads of the semiconductor chip and the inner leads, and a resin made sealing member for covering the semiconductor chip. The wire extends along the extending direction of the wires.


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