The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Nov. 28, 2017
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventor:
Yu-Te Hsieh, Taoyuan, TW;
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 29/06 (2006.01); H01L 21/302 (2006.01); H01L 23/498 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/302 (2013.01); H01L 23/3114 (2013.01); H01L 23/481 (2013.01); H01L 23/49805 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/94 (2013.01); H01L 23/525 (2013.01); H01L 24/13 (2013.01); H01L 29/0657 (2013.01); H01L 2224/29021 (2013.01); H01L 2224/29022 (2013.01); H01L 2224/29034 (2013.01); H01L 2224/29099 (2013.01); H01L 2224/325 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32111 (2013.01); H01L 2224/32112 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83856 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/1659 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16788 (2013.01);
Abstract
Implementations of semiconductor packages may include: a semiconductor wafer, a glass lid fixedly coupled to a first side of the semiconductor die by an adhesive, a redistribution layer coupled to a second side of the semiconductor die, and a plurality of ball mounts coupled to the redistribution layer on a side of the redistribution layer coupled to the semiconductor die. The adhesive may be located in a trench around a perimeter of the semiconductor die and located in a corresponding trench around a perimeter of the glass lid.