The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Mar. 19, 2013
Applicant:

Hitachi Kokusai Electric Inc., Tokyo, JP;

Inventors:

Akihiko Yoneda, Toyama, JP;

Hiroshi Kotani, Toyama, JP;

Yasuhiro Mizuguchi, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67 (2013.01); C23C 16/00 (2013.01);
Abstract

Provided is a substrate processing apparatus which may update an accumulated film thickness of each dummy substrate when a dummy substrate carrier is reloaded. The substrate processing apparatus includes: a process chamber where a plurality of substrates including a dummy substrate are processed; a substrate receiving unit whereon a dummy substrate carrier accommodating at least the dummy substrate is placed; a memory unit configured to store a film thickness of the dummy substrate in the dummy substrate carrier when the dummy substrate carrier is unloaded from the substrate receiving unit; and a management unit configured to update the film thickness of the dummy substrate in the dummy substrate carrier based on the film thickness stored in the memory unit when the dummy substrate carrier is reloaded onto the substrate receiving unit.


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