The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Mar. 13, 2014
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Himanshu Vajaria, San Jose, CA (US);
Tommaso Torelli, San Mateo, CA (US);
Bradley Ries, San Jose, CA (US);
Mohan Mahadevan, Livermore, CA (US);
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); G06T 2207/20076 (2013.01); G06T 2207/30148 (2013.01); Y02P 90/14 (2015.11);
Abstract
Methods and systems for monitoring process tool conditions are disclosed. The method combines single wafer, multiple wafers within a single lot and multiple lot information together statistically as input to a custom classification engine that can consume single or multiple scan, channel, wafer and lot to determine process tool status.
Vajaria, Himanshu. (2019). Wafer and lot based hierarchical method combining customized metrics with a global classification methodology to monitor process tool condition at extremely high throughput (U.S. Patent No. 10290088). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10290088
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile